Products

Electronics-Related Products

Semiconductor-Related Materials

Cleaning Sheet for Encapsulation Molding Die

• N-CS Series

CMP Slurry <HS Series>

• BEOL Application
• FEOL Application

Photosensitive Insulation Coating

• AH Series

Die Bonding Paste

• for Lead Frame
• for Substrate

Die Bonding Film

• Dicing Die Bonding Film
• Underfill film

Film for Semiconductor Related Product

• Dicing Film

Epoxy Molding Compounds

• for Lead Frame
• for Power Devices
• for Substrate

Liquid Encapsulants

• CEL-C Series

Liquid Polyimides

• HD MicroSystems, LLC.

High Heat Resistant Coating Materials

• for Screen Printing
• HL Series

MAP Molding Support Tape

• RT Series

Release Sheet

• RM Series

Display & Touch Panel Related Materials

Anisotropic Conductive Film

• for TAB
• for COG
• for Solderless Connective Film (MF Series)

Printed Wiring Board Materials

• Base Materials for PWBs
• Process Materials for PWBs