AUTOMOTIVE

The Automotive industry is getting changed quickly with innovative trends such as Connected, Autonomous/Automated, Shared and Electrification. Showa Denko Group understands customer's technical challenges and provides materials solutions to create enhanced performance value for you.

Many innovations are happening in technologies in the automotive "CASE" areas such as Connected, Autonomous/Automated, Shared and Electrification. Technical issues and new needs in areas of CASE are for example "Light weight", "Noise and vibration regulations, "Thermal management" as well “high frequency” computing.

Showa Denko Group understands customers challenges in this new era of technologies and is providing valuable material solutions for several applications in the automotive technology field.

Thermal Solution
for power SiC

In order to effectively use the limited battery capacity, power loss reduction, miniaturization or weight reduction of power semiconductors equipped on electric-powered automotive vehicles including fully battery electric vehicles (BEVs) or hybrid electric vehicles (HEVs) has been demanded. Such miniaturization or reduction require properties including high voltage, low on-resistance, high-heat resistance, and high-speed switching ability.
Under such circumstances, silicon carbide (SiC) power semiconductors that meet those needs, which were not provided by conventional silicon (Si) power semiconductors, are expected to provide effective and specific solutions for automotive electrification.
Showa Denko Group suggests SiC epitaxial wafer used for automotive vehicles and several material solutions that can be used even in a severe thermal environment exceeding 200℃ to support SiC properties.

Thermal Solution
for Power Si

The power output of power semiconductors has been increasing, and the amount of current flowing through semiconductor chips has been increasing.
Urgent tasks to maintain the performance of such power semiconductors are to efficiently dissipate the heat around semiconductor chips caused by electricity to reduce heat-related malfunctions, and to ensure insulation performance even when a large amount of current flows. Here, we suggest our heat countermeasure solutions for power semiconductors, which are based on highly-functional or composite materials for ensuring high thermal conductivity and high insulation performance, as well as addressing newly arising challenges.

Our Showa Denko Group shared use customer information which you register into inquiry or data sheet download form to propose our products and services.

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