Showa Denko Materials is a leading company of CeO2 slurry for STI. "GPX" shows excellent polishing performance and it is suitable for finer pattern. In recent years we also developed innovative solution for Tungsten- and Hybrid-Bonding-Slurry solution as well as Nano-Ceria.
Advanced semiconductor devices with high performance are required to have multi-level layers, fine patterns to obtain high speed transmission. CMP process is indespensable to have well-planarized interlayer dielectric or metals in LSI and accomplish the above requirments.
|HS-9000 series||SiO2 slurry|
|Features||--||High planarization||Low scratch||Good workability||--|
|Supply form||--||2 components||2 components||1 component||1 component|
|Residual step height||nm||50||10||10||200|
|Automatic stop on Si3N4||--||Available||Available||Available||Available|