Showa Denko Materials is a leading company of CeO2 slurry for STI. "GPX" shows excellent polishing performance and it is suitable for finer pattern. In recent years we also developed innovative solution for Tungsten- and Hybrid-Bonding-Slurry solution as well as Nano-Ceria.
Advanced semiconductor devices with high performance are required to have multi-level layers, fine patterns to obtain high speed transmission. CMP process is indespensable to have well-planarized interlayer dielectric or metals in LSI and accomplish the above requirments.
Item | Unit | HS-8005 series + HS-8102GP |
HS-8005 series + HS-7303GP |
HS-9000 series | SiO2 slurry |
---|---|---|---|---|---|
Features | -- | High planarization | Low scratch | Good workability | -- |
Supply form | -- | 2 components | 2 components | 1 component | 1 component |
Residual step height | nm | 50 | 10 | 10 | 200 |
Automatic stop on Si3N4 | -- | Available | Available | Available | Available |