AH Series

AH series is photosensitive and low temperature curable insulation coating. It can be patterned via photolithography and provides excellent film properties even by low temperature cure.

Features

  • Positive-tone photosensitive and developable by 2.38% TMAH solution as an aqueous developer
  • Low temperature curable (≦200°C)
  • Excellent film properties
  • Suitable for insulation layers in semiconductor packages

Characteristics (Typical Values)

Items Unit AH Series
Applicable film thickness μm 2~20
Exposure dose* mJ/cm2 400
Cure temperature °C 160~200
Glass transition temperature °C >200
Young's modulus GPa 2.0
Elongation % 50
Coefficient of thermal expansion °C 58
Residual stress MPa 20
Resolution μm ≧2

* 10μm film thickness after cure

Cross Section of AH Series after Cure


Product line-up applicable for various pattern profiles after cure

Application Example of AH Series for Redistribution Insulation Layers on WL-CSP


Application Example of AH Series
for Redistribution Insulation Layers on WL-CSP

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