N-CS series is a sheet type cleaning material which removes stains from the molding die used for semiconductor encapsulation. With higher cleaning performance, it can reduce the time to clean-up molding die, compared with conventional cleaning compounds.
(1) Put the sheet on the molding die.
(2) Compress and mold.
(3) Open the die and remove the sheet.
Item | Cleaning sheet |
Wax sheet |
|||
---|---|---|---|---|---|
N-CS-2000 |
N-CS-5710 |
N-CS-7000 |
N-CS-3300 |
||
Application | Conventional EMC | ○ |
○ |
○ |
○ |
Green compounds | - |
- |
○ |
○ |
|
Clear compounds | - |
○ |
- |
- |
|
Features | Cleaning, recovery of releasability | Low temperature cleaning | Good cleaning performance, and easy to peel off of the die | Applicable for all compounds |
*Tentative data after 300 shot of continuous molding with our green compounds